Chemical Peel - Medium Depth
Type
Chemical Peels
Duration
45 min
Professional chemical peel for skin renewal and anti-aging.
A chemical peel applies a controlled acid solution to the skin to remove damaged outer layers, revealing smoother, more even-toned skin beneath. Peels are categorized by depth: superficial (glycolic, lactic, salicylic acid) treat the outermost layer for mild improvement; medium (TCA, Jessner's) penetrate deeper for more significant correction of pigmentation, fine lines, and acne scars; and deep peels (phenol) address severe sun damage and wrinkles. The controlled exfoliation stimulates the skin's natural healing response, triggering new collagen production and accelerated cell turnover. Results depend on peel depth — superficial peels have minimal downtime with subtle improvement, while deeper peels provide dramatic results but require more recovery time.
Key Details
- Duration
- 20–45 minutes
- Depth Options
- Superficial, medium, or deep
- Downtime
- 1–3 days (superficial) to 7–14 days (deep)
- Results Visible
- 5–7 days after peeling completes
- Course
- Series of 3–6 treatments recommended for best results
Who Is This For?
People with uneven skin tone, sun damage, or hyperpigmentation. Those with acne-prone skin or mild acne scarring. Anyone wanting to improve skin texture and reduce fine lines. People seeking a treatment that stimulates natural collagen production. Those wanting to address dull, rough, or congested skin.
What's Included
Preparation Required
Discontinue retinoids, AHA/BHA products, and exfoliating treatments 5–7 days before your peel. Avoid waxing, laser, or other skin treatments for 2 weeks prior. Use SPF 30+ daily for 2 weeks before treatment. Arrive with clean, makeup-free skin. Inform the provider of any active skin infections, cold sore history, or isotretinoin use in the past 6 months.
- Category
- Skin Treatments
- Sample Type
- Chemical peel treatment
- Duration
- 45 min
Prague Aesthetic Clinic
Premium plastic surgery and dermatology clinic with modern operating facilities.
